| 摘要 |
In the forming method of a thick dielectric pattern, a photosensitive dielectric paste layer relatively low in a softening point is formed on a substrate, and on this substrate, a photosensitive dielectric paste layer relatively high in a softening point is formed, and these paste layers are exposed and developed so as to form a precursor pattern, and through one-shot baking of this precursor pattern, a thick dielectric pattern shape having a lateral side edge portion in a forward tapered shape (tilted toward the outside) and a flat top surface is formed.
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