发明名称 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
摘要 |
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.
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申请公布号 |
US2006002087(A1) |
申请公布日期 |
2006.01.05 |
申请号 |
US20040883534 |
申请日期 |
2004.07.01 |
申请人 |
BEZAMA RASCHID J;COLGAN EVAN G;MAGERLEIN JOHN H;SCHMIDT ROGER R |
发明人 |
BEZAMA RASCHID J.;COLGAN EVAN G.;MAGERLEIN JOHN H.;SCHMIDT ROGER R. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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