| 摘要 |
PROBLEM TO BE SOLVED: To provide a part mounting wiring board wherein no cleaning of flux in a semiconductor chip to be joined is needed by forming a bump on a wiring board, and no influence is given to the part side or the wiring board side even if stress is applied thereto, and to provide a method for mounting parts to a wiring board. SOLUTION: A bump formed of a truncated cone-like copper nucleus 26 with an etched copper plating film and spherical shell-like solder 27 covering the nucleus is formed in a wiring board 21. A conductive film made of paste wherein silver ultrafine particles are scattered is formed at a joint pad and its periphery in a semiconductor chip 11, a plating film with corrosion resistance is formed as a joint pad 18, and then a flux resin film 19 is applied in paste over the entire surface. The semiconductor chip 11 is aligned with the wiring board 21, and heated to reflow the solder 27, thereby hanging down the flux resin film 19 and mounting it after the completion of curing. COPYRIGHT: (C)2006,JPO&NCIPI
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