发明名称 SOLDER TANK
摘要 PROBLEM TO BE SOLVED: To provide a solder tank whose size and cost can be reduced with a simple configuration, in which the consumption of solder is reduced, and with which soldering to the end of a wire is made possible without changing the direction of the wire to be conveyed in a substantially horizontal direction. SOLUTION: A heating means 14 to heat and melt solder and a container 15 to store solder 12 melted by the heating means 14 are provided to a solder tank 10. A hole 17 is bored in a side wall face 16 lower than the level of stored solder 12, which prevents outflow of the solder 12 outside the container 15 by the surface tension of the solder 12, and performs soldering to the end of the wire 11 by inserting the end of the wire 11 from the outside. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006000881(A) 申请公布日期 2006.01.05
申请号 JP20040179100 申请日期 2004.06.17
申请人 KODERA ELECTRONICS CO LTD 发明人 KODERA HIROJI
分类号 B23K3/06;B23K101/38 主分类号 B23K3/06
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