发明名称 METHOD FOR MANUFACTURING NON-CONTACT TYPE IC MEDIA AND NON-CONTACT TYPE IC MEDIA
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing non-contact type IC media for transferring data in a non-contact statue for a reader/writer and the non-contact type IC media for reducing a manufacturing process, and for reducing any influence on an IC chip due to an external force at low costs. <P>SOLUTION: An antenna part 15 is formed on a second piece 12B of a substrate 12, and a rib part 18 is also formed with predetermined height in the peripheral region of the mounting region of an IC chip 17, and an opposite rib part 19 is formed with predetermined height so as to be butted to a rib part 18 when first and second pieces are overlapped on a first piece 12A, and the IC chip 17 is mounted, and then the first and second pieces 12A and 12B are overlapped and bonded so that the rib part 18 and the rib part 19 can be butted to each other. A third piece 12C formed with an extended part 20 is overlapped and bonded to the second piece so that the IC chip 17 can be connected to the both ends of the antenna part 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006004043(A) 申请公布日期 2006.01.05
申请号 JP20040177894 申请日期 2004.06.16
申请人 TOPPAN FORMS CO LTD 发明人 TANAKA TAKASHI;MINAMI YOSHIAKI
分类号 G06K19/077;B42D15/10;G06K19/07 主分类号 G06K19/077
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