发明名称 BONDING APPARATUS AND BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding apparatus which is used to bond adherends each comprising a soft member to an irregular-surfaced work and provides high productivity and improved quality of bonding. SOLUTION: The lower plate 8 that is vertically moved by an elevation mechanism is provided with an adherend set tool 9 with its top face having irregularities inverse to those of the surface of a door trim base 2. A robot that applies a hotmelt adhesive to felt materials set on predetermined positions on the adherend set tool 9. The upper plate 13 is provided with a work set tool 14 on which the door trim base 2 with its surface facing downward is set. A bag 16 connected to a compressed air supply source 18 through an electromagnetic valve 17 is provided between the upper frame 6b and the upper plate 13. By elevating the adherend set tool 9, the felt materials are bonded to the surface of the door trim base 2 while they are kept in the state of positioning. While they are kept in this state, the bag 16 is inflated with supplied compressed air. The bag then produces force of downwardly pressing the door trim base 2 to pressure-bond the felt materials to the door trim base 2. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006002036(A) 申请公布日期 2006.01.05
申请号 JP20040179973 申请日期 2004.06.17
申请人 ASAHI SUNAC CORP 发明人 NAKANO HIROSHI;ITO FUMIO
分类号 C09J5/00 主分类号 C09J5/00
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