| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus which clean a plating liquid still adhered on the surface of a plated substrate to be treated over the whole surface of the substrate to be treated with a uniformly cleaning capacity. SOLUTION: A wafer holder 104 holding, and vertically moving, a wafer 103 is installed at the lower side of a plating device. A cleaning apparatus 1 is installed with three nozzles of 1A, 1B, 1C vertically placed beside a space in which the wafer holder 104 moves vertically. Flat-spray nozzles are used for the middle stage nozzle 1B and the highest stage nozzle 1C, and a slit-type nozzle for the lowest stage nozzle 1A. The respective nozzles supply cleaning liquid to different parts on the surface of the wafer. COPYRIGHT: (C)2006,JPO&NCIPI
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