Semiconductor base component for semiconductor component pile, has boundary regions of substrate surrounding chip, with elastic contact unit which is electrically connected with regions of distribution plate

摘要

The component has a semiconductor chip (7) arranged between a re-wiring substrate (5) and an intermediate distribution plate (6). Boundary regions of the substrate surrounding the chip, has an elastic contact unit (9) which is electrically connected with the boundary regions (10) of the distribution plate. A top side of the plate ahs external contact surfaces whose size corresponds to the size of contact surfaces in the unit. Independent claims are also included for the following: (A) a method for the production of a semiconductor base component (B) a method for producing an elastic contact unit.