APPARATUS FOR PRODUCING IC CHIP PACKAGE

摘要

An apparatus for producing an IC chip package has a conveyance section for conveying a film substrate and has an IC chip mounting section for mounting an IC chip on the film substrate. The IC chip mounting section has a roller having on its surface a chip holding groove and a suction hole and mounting an IC chip on the film substrate by rotating while holding the IC chip, an IC chip supply section having a supply path for supplying IC chips sequentially, and a linear feeder for sending, with a supply end of the supply path exposed to the chip holding groove and the suction hole, the IC chips from the supply end to the IC chip holding groove. Further, the production apparatus has a thermal pressure bonding section for thermal pressure bonding an IC chip and the film substrate. The thermal pressure bonding section has a tape with a magnet and a magnetic tape for pressing the film substrate on a conveyance route without stopping the substrate on the conveyance route and has a heating section for heating the film substrate on the conveyance route without stopping it.