MANUFACTURING METHOD OF ELECTRONIC COMPONENT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component package by which precise sealing can be performed by inexpensively and precisely forming a sealing material. SOLUTION: In a plating process, first plating work including plating for a base is performed on a component wiring pattern and a sealing pattern by using a terminal. Second plating work for completing the sealing pattern by using the terminal is performed after a work connection is disconnected. COPYRIGHT: (C)2006,JPO&NCIPI