发明名称 |
Method of manufacturing a semiconductor device |
摘要 |
<p>The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming. An electromotive force generated by electromagnetic induction is rectified and shaped by using primary coils formed on a check substrate and secondary coils formed on an array substrate, whereby a power source voltage and a driving signal are supplied to circuits or circuit elements on a TFT substrate so as to be driven.</p> |
申请公布号 |
SG117406(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
SG20020001419 |
申请日期 |
2002.03.13 |
申请人 |
MICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
MASAAKI HIROKI;SHUNPEI YAMAZAKI |
分类号 |
G02F1/1368;G09F9/00;G09G3/00;H01L21/336;H01L21/66;H01L21/77;H01L21/84;H01L27/12;H01L27/13;H01L29/786;(IPC1-7):H01L21/66 |
主分类号 |
G02F1/1368 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|