| 摘要 |
An arrangement is provided for cooling a heat-generating device (e.g., an integrated circuit chip) in a system such as a laptop computer. The arrangement includes a piezo pumped heat pipe having a piezoelectric device near an evaporator in the heat pipe. The piezoelectric device, when actuated, helps reduce evaporator resistance when the evaporator evaporates a liquid coolant in the heat pipe.
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