| 摘要 |
The electronic device baffle is a device that is placed within or on top of the housing of an electronic device having a vented cover and electronic motherboard. The baffle is mounted to the vented cover, either above the cover or below the cover, and is situated above the motherboard. The baffle is designed to prohibit contaminants from contacting the motherboard without restricting the necessary flow of air through the vented cover. The baffle has sidewalls and a plurality of legs that may be attached to the sidewalls. The legs are affixed to the top or the bottom of the vented cover and support the baffle above the motherboard.
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