SENSOR CHIP AND MANUFACTURING METHOD THEREOF

摘要

A sensor chip is provided with a board, a cover layer, a spacer layer sandwiched between the board and the cover layer, and a hollow reacting part between the board and the cover layer. The sensor chip does not warp due to changes of temperature and humidity in the environment. A method for manufacturing such sensor chip is also provided. The sensor chip is provided with the board, the cover layer, the spacer layer sandwiched between the board and the cover layer, the hollow reacting part between the board and the cover layer, and a detecting means in the hollow reacting part. The board and the cover layer are made of the same material and have the same thickness. The material and the shape of the spacer layer are symmetric to a flat plane which is parallel to the board at equal distances from the board and the cover layer.