A modular speed bump includes a low profile base having first and second low profile ramps each having a raised inner portion and an outer edge. A elongated member is interposed between the first and second low profile ramps and extends upwardly from the low profile base. The ramps are connected to the elongated member and slope gradually to their respective outer edges. First and second end portions are located at opposing ends of the speed bump, each end portion being configured to interlock with a modular speed bump.
