发明名称 CHEMICAL-MECHANICAL POLISHING COMPOSITION AND METHOD FOR USING THE SAME
摘要 The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive comprising alpha-alumina, (b) 0.05 to 50 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention also provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from the group consisting of alpha-alumina, gamma-alumina, delta-alumina, theta-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) 0.05 to 3.5 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, magnesium, zinc, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention further provides methods of polishing a substrate using each of the above-described chemical-mechanical polishing compositions.
申请公布号 WO2005100496(A3) 申请公布日期 2005.12.29
申请号 WO2005US08411 申请日期 2005.03.14
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 DE REGE THESAURO, FRANCESCO;MOEGGENBORG, KEVIN;BRUSIC, VLASTA;BAYER, BENJAMIN
分类号 C09G1/02;H01L21/321 主分类号 C09G1/02
代理机构 代理人
主权项
地址