发明名称 |
Method of soldering electronic component having solder bumps to substrate |
摘要 |
A method of soldering electronic component ( 6 ) having solder bumps ( 7 ) formed thereon to substrate ( 12 ), wherein bumps ( 7 ) are pressed against a flux transferring stage on which a thin film is formed of flux ( 10 ) containing metal powder ( 16 ) of good wettability to solder so as to cause metal powder ( 16 ) to penetrate oxide films ( 7 a) and embed in the surfaces on the bottom parts of bumps ( 7 ), and bumps ( 7 ) in this state are positioned and mounted to electrodes ( 12 a) on substrate ( 12 ). Substrate ( 12 ) is then heated to melt bumps ( 7 ) and allow the melted solder to flow and spread along the surfaces of metal powder ( 16 ) toward electrodes ( 12 a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.
|
申请公布号 |
US2005284921(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20050157921 |
申请日期 |
2005.06.22 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SAKAI TADAHIKO;MAEDA TADASHI |
分类号 |
H01L21/60;H05K3/34;(IPC1-7):B23K31/00 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|