发明名称 |
METHOD FOR EMBEDDING AN IC COMPONENT INTO A FOAMED LAYER OF A CHIP CARD |
摘要 |
<p>The invention relates to a method for producing monolayer and multilayer chip cards (1) and to a method for producing a semi-finished product for chip cards and to a corresponding semi-finished product. Cavities (21) are embossed into a foamed plastic material (20). The electronic components (30) of the chip cards are inserted into said cavities. The pre-embossed, foamed plastic material (20) may be used as a monolayer chip or, if provided with the electronic components, as a card inlet for a monolayer card or a laminate card. The production of cavities for the electronic components by deep-embossing foamed plastic material is inexpensive and subjects the electronic components to a minimum of mechanical stress. The embossing method facilitates the production of cavities having complex geometrical shapes.</p> |
申请公布号 |
EP1147488(B1) |
申请公布日期 |
2005.12.28 |
申请号 |
EP19990959298 |
申请日期 |
1999.11.22 |
申请人 |
GIESECKE & DEVRIENT GMBH |
发明人 |
HOPPE, JOACHIM;HOHMANN, ARNO;STRASSMAIER, JOSEF;ZAPF, RUDOLF |
分类号 |
B29C44/56;B29C59/02;B32B37/18;G06K19/077;(IPC1-7):G06K19/077;B29C43/18 |
主分类号 |
B29C44/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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