发明名称 Method for attaching an integrated circuit package to a circuit board
摘要 A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.
申请公布号 US6978539(B2) 申请公布日期 2005.12.27
申请号 US20020064462 申请日期 2002.07.17
申请人 COMPAL ELECTRONICS, INC. 发明人 KUNG SHAO-TSU;LIU CHEN-HUA
分类号 H05K1/02;H05K3/30;H05K3/34;(IPC1-7):H05K3/30 主分类号 H05K1/02
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