| 摘要 |
A method for forming an isolation layer of a semiconductor device which is capable of improving isolation characteristics of a highly integrated semiconductor device. The method includes the steps of forming a first insulating layer on a substrate; forming both a first recess in the first isolation region and a plurality of second recesses in the second isolation region by only once applying a photolithography process to the first insulating layer; forming a third recess, which is deeper than the first recess, in the center area of the first recess in the first isolation region; and filling the first, second, third recesses with insulating materials or a thermal oxide layer. In addition, in the semiconductor device includes isolation regions have different widths, wherein the first isolation region, which is relatively narrower in width than the second isolation region, has a deeper recess than the second isolation region.
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