| 摘要 |
PROBLEM TO BE SOLVED: To securely separate chip components as continuously transferred workpieces, at high speed. SOLUTION: In this supplying and separating method of the chip components 1, the chip components 1 are sequentially supplied from a chute 20 for transferring the chip components 1 on a rotating disk 40 and separated. In the state that the chip component 1-2 next to the chip component 1-1 sequentially supplied from the chute 20 is pressed by a stopper means 30 and stopped, the preceding chip component 1-1 is supplied on the rotating disk 40. A sensor is arranged in a position for detecting supply of the chip component 1-1 on the rotating disk 40. At least during a period when the chip component 1-1 is detected by the sensor, pressing of the chip component 1-2 by the stopper means 30 is continued. COPYRIGHT: (C)2006,JPO&NCIPI
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