发明名称 POLYMER, POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要 Disclosed is a polymer which enables to form a resist pattern having high resolution and excellent etching resistance. Also disclosed are a positive resist composition and a method for forming a resist pattern. Specifically disclosed are a polymer having a constitutional unit (a1) represented by the general formula (a-1) below and a constitutional unit (a2) represented by the general formula (a-2) below, another polymer having the constitutional unit (a1) and a constitutional unit (a3) represented by the general formula (a-3) below, and a still another polymer having the constitutional unit (a1), the constitutional unit (a2) and the constitutional unit (a3). (a-1) (a-2) (a-3)
申请公布号 WO2005121193(A1) 申请公布日期 2005.12.22
申请号 WO2005JP10135 申请日期 2005.06.02
申请人 TOKYO OHKA KOGYO CO., LTD.;TAKESHITA, MASARU;HADA, HIDEO;HAYASHI, RYOTARO;IWAI, TAKESHI;MATSUMARU, SYOGO;FUJIMURA, SATOSHI 发明人 TAKESHITA, MASARU;HADA, HIDEO;HAYASHI, RYOTARO;IWAI, TAKESHI;MATSUMARU, SYOGO;FUJIMURA, SATOSHI
分类号 C08F32/08;G03F7/004;G03F7/039;H01L21/30 主分类号 C08F32/08
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