发明名称 APPARATUS AND TOOL FOR BONDING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and tool for bonding components in which vibration transmission to a component is stabilized and bonding quality can be secured. SOLUTION: In the tool, load and vibration are operated on the electronic component 4 and it is pressed on a substrate 3. A bonding object 9 is detachably loaded in a through hole in a cone taper shape, which is arranged in a horn 8. The bonding object 9 abuts on an inner face of the through hole on the lower side and an upper side of the center line CL of the horn 8 in a state where a lightening part 9f is worked in an outer taper face of the bonding object 9, and a fastening member 10 fixes and fastens the bonding object 9 to the horn 8. Thus, lever length L of the fastening part is secured to be as large as possible, and rigid fixing and fastening are realized. Even if alternating bending moment M at the time of a component bonding operation is operated, vibration which is always stable is transmitted, bonding quality can be secured and component durability can be improved. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005353794(A) 申请公布日期 2005.12.22
申请号 JP20040172154 申请日期 2004.06.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HISAKU MASAFUMI;TAKAHASHI SEIJI
分类号 H05K3/32;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/32
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