发明名称 SOLID ELECTROLYSIS CAPACITOR AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thin solid electrolysis capacitor which can be built in a wiring board, be arranged near a semiconductor chip such as a CPU or the like mounted to the wiring board, and be easily manufactured when using conductive polymer as a solid electrolysis, and to provide its manufacturing method. SOLUTION: A solid electrolysis capacitor 30 has an electrode layer 14 in one side, and a conductor layer 17 connecting to the electrode layer 14 in the other side; it comprises a pair of insulating substrates 25, 26 which face each other by directing the electrode layer 14 to exterior and are connected with each other by means of a connecting member 21a and a solid electrolysis layer 28 arranged between these insulating substrates 25, 26; and a dielectric layer 17a exists between at least one of the conductor layers 17 of a pair of the insulating substrates 25, 26 and the solid electrolysis layer 28. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005353963(A) 申请公布日期 2005.12.22
申请号 JP20040175292 申请日期 2004.06.14
申请人 SHINKO ELECTRIC IND CO LTD 发明人 SAKAGUCHI HIDEAKI;AIZAWA MITSUHIRO;AZUMA MITSUTOSHI
分类号 H01G9/028;H01G9/00;H01G9/004;H01G9/04;H01G9/14;(IPC1-7):H01G9/04 主分类号 H01G9/028
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