POLISHING PAD HAVING WINDOW WITH STRESS REDUCED

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad with a stress reduced for end point detection and measurement of CMP and a manufacturing method of the same.

SOLUTION: The manufacturing method is for forming a chemical mechanical polishing pad which includes the performing a primary annealing on the window independent of a polishing pad material and the supplying of the polishing pad material to the periphery of the primarily annealed window before quenching the primarily annealed window to a predetermined temperature. The method further includes the performing a secondary annealing on the window together with the polishing pad material and cutting the secondarily annealed window and polishing pad material in predetermined thicknesses.

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