| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electroless plating method for stably forming an electroless plating layer for covering whole terminal faces of electrode terminals, even if electroless plating is performed on the terminal faces of the electrode terminals formed on one face side of a wafer formed of silicon under illumination. <P>SOLUTION: When electroless plating is performed on the terminal faces of the electrode terminals 12 formed on one face side of the silicon wafer 10, a dicing tape 16 as an electric insulating material is stuck to the whole other face side of the wafer 10. Electroless plating is performed on the terminal faces. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
