发明名称 LEAD FRAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR INSPECTING ELECTRICAL PROPERTIES OF SMALL DEVICE USING THE LEAD FRAME
摘要 A lead frame comprises a plurality of frame assemblies. Each framework assembly includes a framework, a suspension lead, a die pad, a plurality of inner leads and outer leads, a first tie bar and a second tie bar, and a lead support. The plurality of framework assemblies are disposed alongside of one another in a direction perpendicular to a direction in which the plurality of outer leads extend. A distance between close-set outer leads in each two neighboring frameworks is substantially n times a pitch of the plurality of outer leads in each framework, wherein n is an integer.
申请公布号 KR100538020(B1) 申请公布日期 2005.12.21
申请号 KR20030018848 申请日期 2003.03.26
申请人 发明人
分类号 G01R31/26;H01L23/495;H01L23/50 主分类号 G01R31/26
代理机构 代理人
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