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发明名称
光半导体元件模组及双向模组
摘要
【课题】提供一种光半导体元件模组及双向模组,即使半导体元件或球透镜之组立精度很小,也能以低成本来获得很高的结合效率。【解决手段】光结合到光纤(10)之半导体雷射二极体(1),系搭载在柄体(6)上。又,固定在柄体(6)之盖体(8),系在光纤(10)及半导体雷射二极体(1)之间具有透光孔部,在透光孔部安装有球透镜(7)。球透镜(7)之折射率系1.9以上,其直径系1.5mm~2.5mm。
申请公布号
TW200541087
申请公布日期
2005.12.16
申请号
TW094113879
申请日期
2005.04.29
申请人
三菱电机股份有限公司
发明人
羽田英树;田端诚一郎;河村敦志
分类号
H01L31/0232;G02B6/42;H01L33/00
主分类号
H01L31/0232
代理机构
代理人
洪澄文
主权项
地址
日本
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