| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer printed wiring board wherein fine wiring is formed on a smooth insulating board with high adhesion strength between them, and also to provide the manufacturing method of the multi-layer printed wiring board forming the fine wiring having good adhesion onto the smooth insulating board without requiring etching process. SOLUTION: This multi-layer printed wiring board comprises: an arbitrarily formed first conductive pattern, an insulating material layer and; a second conductive pattern formed by giving a conductive material in a pattern shape to a region in accordance with a graft polymer pattern formed on the insulating material layer in this order. The wiring board also has a conductive path for connecting the first conductive pattern and the second conductive pattern existing on the insulating board. Above-mentioned graft polymer pattern consists of existence region/non-existence region of the graft polymer or consists of existence region of hydrophilic graft polymer/existence region of hydrophobic graft polymer region. COPYRIGHT: (C)2006,JPO&NCIPI |
