SUBSTRATE DIVIDING METHOD, ITS APPARATUS, AND ELEMENT HAVING JOINING SURFACE

摘要

PROBLEM TO BE SOLVED: To provide a method for dividing a substrate having a small width of an ineffective portion, its apparatus, and an element having a joining surface excellent in mechanical strength. SOLUTION: As shown in (a), joined substrates, where a first substrate and a second substrate are joined, is prepared, as in (b), a notch 3 is formed, and as in (c), a dicing scribe is formed. Then, as in (d), a surface opposite to the joined surface is etched for the first substrate 1, and applying a pressure as an arrow, the second substrate 2 is divided to divide the joined substrates. COPYRIGHT: (C)2006,JPO&NCIPI