| 摘要 |
PROBLEM TO BE SOLVED: To make possible the contraction of the area of a solid photographing element chip and miniaturize its package, by making unnecessary complex intra-chip wirings. SOLUTION: The solid photographing element chip 101 is so stored in a package 102 as to constitute a solid photographing device 100. The solid photographing element chip 101 has first pad electrodes 110a, 111a, 112a, 113a disposed in its one side edge, and has second pad electrodes 110b, 111b, 112b, 113b disposed in its other side edge. Further, intra-package wirings 110c, 111c, 112c, 113c are interposed connectively between the first pad electrodes 110a, 111a, 112a, 113a and the second pad electrodes 110b, 111b, 112b, 113b. By using the intra-package wirings, intra-chip wirings can be simplified and the size of the chip can be contracted. COPYRIGHT: (C)2006,JPO&NCIPI
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