发明名称 |
Method and structures for indexing dice |
摘要 |
A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
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申请公布号 |
US2005275068(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20050109977 |
申请日期 |
2005.04.19 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
BRAMBILLA DANIELE A.;VALTOLINA MARCO N. |
分类号 |
G01R31/26;H01L23/544;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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