| 摘要 |
A method and apparatus to stencil interposers on a wafer of dies is described. In one embodiment, an interposer stenciling apparatus includes an interposer forming stencil configured to deposit interposer material onto a backside of a wafer of dies in a predetermined formation. In another embodiment, another interposer forming stencil is configured to form additional interposer layers on existing interposers to support dies thereon having different size configurations.
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