| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate the problem, wherein it is necessary to have a polishing composition capable of effectively preventing metal contamination with nickel, chrome, iron, copper or the like, and to provide a polishing composition for a silicon wafer capable of preventing the metal cotamination, particularly copper contamination, in the polishing of the silicon wafer. <P>SOLUTION: The polishing composition for a silicon wafer containing silica of average particle size of 5 to 500 nm and concentration of 0.05 to 30 wt% to the entire polishing composition, alkali of concentration of 0.01 to 10 wt% to the entire polishing composition, aminopolysulfonic acid and water, is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
