MICROELECTROMECHANICAL DEVICE PACKAGES WITH INTEGRAL HEATERS

摘要

A microelectromechanical device package with integral a heater (220) and a method for packaging the micro-electromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate (210) and second substrate (215), between which a microelectromechanical device, such as a micromirror array device is (105) located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer (230) is deposited, and heated by the heater (220) so as to bond the first and second package substrates together.