Dicing ultra-thin wafer in to multiple integrated circuits, by fixing carrier wafer to front of product wafer, forming separating trenches between integrated circuits

摘要

The method involves fixing a carrier wafer (6) with a binder (5) onto the front of a product wafer (1), and thinning the product wafer from its rear side to a final thickness (d1). Back side processing is performed on the thinned wafer. Separating trenches (12) are formed between the integrated circuits in a saw guide region of the product wafer to form individual components. The carrier wafer is removed with the attached components and ribs engaging in the separating trenches. The carrier wafer and binder are released from the individual components. An independent claim is included for a holding device.