| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of uniformly and efficiently polishing a substrate of a semiconductor wafer and a printed board, etc. SOLUTION: In this polishing device for a substrate 30, the surface of the substrate 30 is polished by polishers 12 and 16 by using polishing liquid 10, while carrying the substrate 30 in one direction by carrying mechanisms 14a, 14b, 15a and 15b. The device is provided with a carrying mechanism for carrying the substrate 30 in a submerged state in the polishing liquid 10 from one side of a reservoir tank 20 for storing the polishing liquid 10 to the other side. The device is provided with the polishers 12 and 16 rotated and driven since an outer peripheral surface is in contact with the polishing liquid 10 stored in the reservoir tank 20 when carrying the substrate 30 by the carrying mechanism, formed into a cylindrical shape as a whole shape and having the outer peripheral surface formed into a polishing surface in contact with the surface of the substrate 30. COPYRIGHT: (C)2006,JPO&NCIPI |
