PACKAGING METHOD THROUGH CONDUCTIVE ADHESIVE, QUALITY JUDGING METHOD OF PACKAGED STATE, AND CONDUCTIVE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a packaging method suppressing electrical connection resistance low and stabilizing electrical connection even in the case of packaging components through a conductive adhesive. SOLUTION: The method of packaging components on a substrate through a conductive adhesive containing a conductive filler in a resin binder comprises: a process of conveying the component to the vicinity of the conductive adhesive that is added to the substrate at a prescribed conveyance speed; a process of adding a set load to the conductive adhesive and the component and pushing the component to the lower limit of pressing at which the set load and the repulsion of the conductive adhesive are balanced at a pushing speed that is set lower than the conveyance speed; and a process of holding the component for a predetermined time at the position with the lower limit of pressing. COPYRIGHT: (C)2006,JPO&NCIPI