| 摘要 |
PROBLEM TO BE SOLVED: To prevent transferring of an electronic component from a first holding fixture to a second holding fixture from occurring by generating a stable adhesion force difference between the first holding fixture and the second holding fixture with a simple configuration. SOLUTION: In the state that the first end face P1 of a chip-shape electronic part P is adhesively held on the adhesion layer 12 of the first holding fixture 1. The adhesion layer 22 of the second holding fixture 2 is forced to a second end face P2, and the second holding fixture 2 is pulled apart from the first holding fixture 1. Both of the adhesion layers 12, 22 are made of the same material, and the adhesion layer 22 is thinner than the adhesion layer 12. Accordingly, the adhesion layer 22 is stronger adhesion force than the adhesion layer 12. And, the electronic component P can be transferred certainly from the first holding fixture 1 to the second holding fixture 2. COPYRIGHT: (C)2006,JPO&NCIPI
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