发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT COMPRISING THE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an polyamide resin composition compounded with inorganic fillers or pigments in a polyamide resin at a high concentration but nevertheless having excellent fluidity and good moldability. SOLUTION: The polyamide resin composition comprises (A) a polyamide resin, (B) an inorganic filler and/or a pigment, and (C) an amino alcohol represented by general formula (1). [Wherein, n is an integer of 0-5; and R<SP>1</SP>to R<SP>5</SP>are one selected from a group consisting of H, CH<SB>2</SB>CH<SB>2</SB>OH and CH<SB>2</SB>CH(CH<SB>3</SB>)OH, and at least one of them is CH<SB>2</SB>CH<SB>2</SB>OH or CH<SB>2</SB>CH(CH<SB>3</SB>)OH]. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005343991(A) 申请公布日期 2005.12.15
申请号 JP20040164423 申请日期 2004.06.02
申请人 DAINIPPON INK & CHEM INC 发明人 KAMIKADO NOBUAKI;MIYAO SATOSHI;TANAKA KATSUNORI
分类号 C08L77/00;C08K3/00;C08K5/17;(IPC1-7):C08L77/00 主分类号 C08L77/00
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