| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure for mounting a chip component on the surface of a circuit board by soldering, the mounting structure as nearly free of trouble of a tombstone phenomenon during the manufacture and capable of being manufactured at low cost and the long thermal fatigue life of a solder zone. SOLUTION: The mounting structure 100 has a dummy electrode 40d on the surface of the chip component 40 which faces the circuit board 50 between electrodes 40c provided at both ends, has a pad electrode 50b to connect with the electrodes 40c and a dummy pad electrode 50c to connect with the dummy electrode 40d formed on the surface of the circuit board 50 to protrude from the projection area of the chip component 40 to the circuit board 50, and further has the electrodes 40c fixed to the pad electrode 50b and the dummy electrode 40d fixed to the dummy pad electrode 50c by soldernig as shown by 30 and 31 respectively. COPYRIGHT: (C)2006,JPO&NCIPI
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