MEASUREMENT METHOD AND DEVICE THEREOF, ALIGNER, AND DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To attain the measurement of the distortion of the projection optical system of an aligner using a pattern which is 100 nm or less with high precision and high throughput.

SOLUTION: This measurement method is provided to measure the distortion of a projection optical system for projecting a reticle pattern formed in a reticle to be used for an aligner which exposes the pattern to an object to be processed. This measurement method comprises a first exposure step to expose a mark pattern having a mark at a position corresponding to the angle of view of the measurement projection optical system to be measured on the object to be processed in the overall shot region of the aligner, a second exposure step to expose only the neighboring mark on the axis of the projection optical system of the mark pattern on the object to be processed, a measurement step to measure the shape of the mark formed on the object to be processed through the first exposure step and the second exposure step, and a calculation step to calculate the distortion of the projection optical system from the shape of the mark measured in the measurement step.

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