发明名称 |
Eddy current sensing of metal removal for chemical mechanical polishing |
摘要 |
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
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申请公布号 |
US6975107(B2) |
申请公布日期 |
2005.12.13 |
申请号 |
US20030446367 |
申请日期 |
2003.05.27 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HANAWA HIROJI;JOHANSSON NILS;SWEDEK BOGUSLAW;BIRANG MANOOCHER |
分类号 |
B24B37/04;B24B49/02;B24B49/12;G01B7/06;G01N27/90;H01L21/00;(IPC1-7):G01N27/90 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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