发明名称 Eddy current sensing of metal removal for chemical mechanical polishing
摘要 A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
申请公布号 US6975107(B2) 申请公布日期 2005.12.13
申请号 US20030446367 申请日期 2003.05.27
申请人 APPLIED MATERIALS, INC. 发明人 HANAWA HIROJI;JOHANSSON NILS;SWEDEK BOGUSLAW;BIRANG MANOOCHER
分类号 B24B37/04;B24B49/02;B24B49/12;G01B7/06;G01N27/90;H01L21/00;(IPC1-7):G01N27/90 主分类号 B24B37/04
代理机构 代理人
主权项
地址