发明名称 |
Method for manufacturing thin semiconductor chip |
摘要 |
In manufacturing a thin semiconductor chip, a wafer is stably held during processing to maintain a stable shape and to avoid generation of cracks on the wafer. When a thin wafer having a surface thereon is to be processed, a rigid support body is adhered to the other surface of the thin wafer and a ring-shaped frame, encircling an outer periphery of the thin wafer, is adhered to the rigid support body.
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申请公布号 |
US6974721(B2) |
申请公布日期 |
2005.12.13 |
申请号 |
US20040496690 |
申请日期 |
2004.05.26 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KOIZUMI NAOYUKI;MURAYAMA KEI;MIZUNO SHIGERU;KURIHARA TAKASHI |
分类号 |
H01L21/301;H01L21/00;H01L21/02;H01L21/68;H01L21/78;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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