| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having an excellent temperature characteristic, and its manufacturing method. <P>SOLUTION: A sensor chip 2 is constituted of a terminal block 3 and an acceleration sensor part 4, and arranged in a package 1 comprising a case 1a and a cover 1b. In this case, the first space A1 is formed between the under surface of the acceleration sensor part 4 and the inner surface of the case 1a, and the second space A2 is formed between the upper surface of the acceleration sensor part 4 and the inner surface of the cover 1b, and the acceleration sensor part 4 is constituted so that only one end face is connected to the case 1a through the terminal block 3, and that the other surfaces are out of contact with the package 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
