发明名称 VAPOR DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus capable of individually temperature-controlling the emission of dissimilar materials, and substantially uniformizing ratio of the component of the thickness of a film deposited on a member to be vapor-deposited. SOLUTION: The vapor deposition apparatus in which a evaporation material is vapor-deposited on a glass substrate 1 held in a container 3 for vapor deposition, is provided with: two containers 6, 7 for evaporation to heat dissimilar vapor deposition materials A, B to obtain the evaporation material; containers 4, 5 for emission which are arranged in the container 3 for vapor deposition and each have a plurality of emission holes 4b, 5b to emit the evaporation material; and evaporation material guide tubes 8, 9 to guide the evaporation material obtained in each container for evaporation into the predetermined containers 4, 5 for emission, respectively, wherein the emission hole 5b at the distal end of a nozzle 5c for emission protruded from one container 5 for emission is concentrically arranged in the emission hole 4b formed in the other container 4 for emission. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005336527(A) 申请公布日期 2005.12.08
申请号 JP20040155383 申请日期 2004.05.26
申请人 HITACHI ZOSEN CORP 发明人 INOUE TETSUYA;DAIKU HIROYUKI;SUZUKI KAZUTO
分类号 H05B33/10;C23C14/24;H01L51/50;H05B33/14;(IPC1-7):C23C14/24 主分类号 H05B33/10
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