PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION

摘要

[PROBLEMS] Disclosed is a photosensitive polyimide precursor composition capable of forming a resin film which has low thermal expansion coefficient, thereby suffering less from lowering of adhesion to a base or warping of the base and being free from deterioration in electrical characteristics, resolution or the like. [MEANS FOR SOLVING PROBLEMS] Such a photosensitive polyimide precursor composition is characterized by containing a polyimide precursor having a benzoazole skeleton in the main chain while having a specific group in a side chain or in the main chain, and if necessary a sensitizer. Since this photosensitive polyimide precursor composition has a low thermal expansion coefficient after polyimidation, the thermal expansion coefficient difference between a base with low thermal expansion coefficient such as a silicon wafer and a polyimide obtained by applying and thermally cyclizing the photosensitive polyimide precursor composition on the base can be small. In addition, since adhesion between the base and the polyimide is good and warping can be suppressed while maintaining good developability and sensitivity, there can be obtained a good pattern.