| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for easily and collectively manufacturing more display devices using a thinner substrate. <P>SOLUTION: After a substrate 11 is welded on a support substrate 12 by being irradiated with a laser beam 70, a plurality of thin film patterns 17 are formed and a sealing substrate 18 is bonded. The substrate 11 and the sealing substrate 18 are divided by being irradiated with the laser beam 70 again and a display panel is cut out. The welding, forming of a scribe line and conveying can be carried out in a state that the substrate 11 and the sealing substrate 18 are overlapped and placed on the support substrate 12 which is thicker and less deflected than those substrates. As the substrate 11 and the sealing substrate 17 having desired thickness are used from the beginning, processing of the thickness direction by chemical etching and mechanical polishing etc. becomes unnecessary. A plurality of organic light emitting display devices equipped with the thinner and lighter display panel 10 can be manufactured easily and collectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
