发明名称 cooling structure of an electronic element
摘要 A cooling structure of an electronic element is disclosed in which a smooth heat transfer can be carried out via a variety of heat transfer routes of conduction and convention without recourse to a forced cooling means such as a fan or the like, thus improving the cooling performance of electronic elements and stabilizing the operation of electronic circuits for a long period of time.
申请公布号 KR100534968(B1) 申请公布日期 2005.12.08
申请号 KR20030063971 申请日期 2003.09.16
申请人 发明人
分类号 H05K7/20;H01L23/36;H01L23/367;H05K1/02;(IPC1-7):H05K7/20 主分类号 H05K7/20
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