| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable optical semiconductor device in response to a request of a high definition image and optical high-precision detection by improving junction intensity at the short side of an optical semiconductor device when a rectangular optical semiconductor device is mounted. SOLUTION: The optical semiconductor device is provided with: an insulating base 102 where the mount part of the optical semiconductor device 101 on formed in the upper surface; a wiring conductor 104 formed toward the upper surface of the insulating base 102; a rectangular optical semiconductor device 101 mounted and joined to the mount part via a jointing material 103; and a lid body 105 attached so that a space where the optical semiconductor device 101 is mounted is formed on the upper surface of the insulating base 102. While the jointing material 103 covers the short side of the optical semiconductor device 101, the surface of the portion of the covered side is formed in an uneven form. COPYRIGHT: (C)2006,JPO&NCIPI |
